Layer-by-layer assembly of boron arsenide and copper nanoflake-based aramid nanofibers for thermoconductive electromagnetic interference shielding materials with superior mechanical flexibility and flame retardancyPublication / Để lại một bình luận
Dual 3D networks of graphene derivatives based polydimethylsiloxane composites for electrical insulating electronic packaging materials with outstanding electromagnetic interference shielding and thermal dissipation performances Publication
Ultrathin thermally conductive yet electrically insulating exfoliated graphene fluoride film for high performance heat dissipation Publication
